


DPA Test for EEPROM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for EEPROM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
1530 results found for EEPROM/ROM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-32
200 ns
2M (256K x 8)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
250 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
200 ns
4M (128K x 32)
QML H
Not qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
120 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
150 ns
4M (128K x 32)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
300 ns
64K (8K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
120 ns
64K (8K x 8)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-32
150 ns
2M (256K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
120 ns
1M (128K x 8)
QML H
Not qualified
QPDSIS-38534
Surface Mount
CQFP-68
200 ns
4M (128K x 32)
Part validation activities
Cost & Activity Matrix