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Bond Pull Test for Data Selector-Mux ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Data Selector-Mux ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1000 results found for Data Selector-Mux/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
3-State Outputs
Type
TID (krads)
SEE (MeV/mg/cm2)
Configuration
Number of Channels
Unit price
Lead time
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Without
Multiplexer
2:1
4
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-16
With
Data Selector/Multiplexer
2:1
4
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Without
Multiplexer
2:1
4
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Without
Data Selector/Multiplexer
TID (HDR): 500.0
SEL (Let): 120.0
SEU (Let): 108.0
4:1
2
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
With
Multiplexer
2:1
4
JAN B
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
With
Data Selector/Multiplexer
2:1
4
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
With
Data Selector/Multiplexer
TID (HDR): 500.0
SEL (Let): 120.0
SEU (Let): 80.0
4:1
2
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Without
Data Selector/Multiplexer
2:1
4
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16