MIL-STD-750, Method 2052 Mechanical Test Methods for Semiconductor Devices Part 2: Particle impact noise detection (PIND) test
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The purpose of this test method is to detect loose particles inside a semiconductor device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact with the case, excite the transducer.
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MIL-STD-750, Method 2052
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MIL-STD-750, Method 2052
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