MIL-STD-883, Method 2022 Mechanical Test Method Standard for Microcircuits: Wetting balance solderability

The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm) in thickness which are normally joined by a soldering operation and used on microelectronic devices.