MIL-STD-883, Method 2003 Mechanical Test Method Standard for Microcircuits: Solderability

General data

The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to 0.125 inch in diameter) that will be assembled using tin lead eutectic solder.
13 /
Active
16/09/2019 0:00:00
0 pages

Document history

Reference
Issue
Revision
MIL-STD-883, Method 2003
13
K

Document preview

Previous
{{docCtrl.currentPage}} of {{docCtrl.totalPages}} Pages
Next

Related documents

Related documents