390101942B 3901/019 Var. 42 - LEONI Special Cables

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ESCC Family 13 - 01

General data

Polyimide Insulated Wires and Cables Low Frequency 600V -200 to +200 degree C, based on type SPL
390101942B
3901/019 Var. 42
LEONI Special Cables
ESCC B
Qualified
295D
I

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
 
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DPA
400
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • Radiographic Inspection
  • Solderability
  • Marking Permanence
  • Micro Sectioning
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INCOMING
150
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
 
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
ESCC 3901
3
-
31/01/2017 0:00:00
Download
Detailed spec.
ESCC 3901/019
3
-
31/05/2013 0:00:00
Download
QPL/QML
ESCC QPL
197
-
15/05/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
N
N
N
N
Mechanical Data
20
Unshielded
Generic Functional & Electrical
-200ºC to +200ºC
-200ºC to +200ºC
Specific Functional & Electrical
7,5A
Qualification Status
Y

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