General data

Microcircuit, Digital-Linear, 18 Bit, 250 Ksps Differential Analog to Digital Converter, Monolithic Silicon
V62/14632-01XE
AD7691SRMZ-EP-RL7
Analog Devices
EP
Not qualified
Not Applicable
PSO-10 (Gull Wing)

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
5000
5000
10
 
Request proposal
DPA
600
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • CSAM (Only for plastic and with added costing)
  • Hermeticity (If applicable)
  • PIND Test (If cavity)
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection
  • SEM Inspection
  • Bond Pull Test
  • Die Shear Test
Request proposal
INCOMING
250
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
Request proposal
RELIFING
60
50
35
400
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
Request proposal
PIND
250
4
 
Mechanical Test Method Standard for Microcircuits, Particle impact noise detection test:
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Documentation

Type
Name
Issue
Rev
Date
Detailed spec.
V62/14632
-
-
16/12/2014 0:00:00
Download
QPL/QML
Not Applicable
-
-
Download

EEE parts validation according to quality project requirements

Additional info

Alerts
Reference
Summary
Description
PCN16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Qualify TeamQuest Technology, Inc.as an additional site for Burn-in and Group C High Temp Operating Life Test (HTOL) processes for Military and Aerospace products (includes all MIL-PRF-38535 QMLV, JANS, Standard Space Grade and Class K die qualifications). Reference Test Methods 1015 & 1005 of MIL-STD-883.

Parameters

Radiation: Potential Sensitivity
Y
Y
Y
Y
CMOS & BICMOS: SEL (except SOI), SEU, SEFI, SET, SED; BIPOLAR: SEU, SET
Only bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
External
SAR
Radiation Features: SEE
Mechanical Data
Plastic
Gold Flash Palladium
PSO-10 (Gull Wing)
Surface Mount
10
Radiation Features: TID & TNID
Bipolar technology devices are sensistive to low dose rate
Generic Functional & Electrical
150ºC
44ºC/W
-65ºC to +150ºC
12,5mW
200ºC/W
Class 1
-55ºC to +105ºC
Specific Functional & Electrical
15,32-Bits
94db
1,25LSB
18-Bits
Differential
94db
1
250KSPS
2LSB
Serial
Qualification Status
N

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