V62/06637-09XE TPS3837K33QDBVREP - Texas Instruments

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General data

Microcircuit, Linear, Nanopower Supervisory Circuits, Monolithic Silicon
V62/06637-09XE
TPS3837K33QDBVREP
Texas Instruments
EP
Not qualified
Not Applicable
MO-178

Component popularity vs family & manufacturer

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
4000
3000
10
 
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DPA
600
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • CSAM (Only for plastic and with added costing)
  • Hermeticity (If applicable)
  • PIND Test (If cavity)
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection
  • SEM Inspection
  • Bond Pull Test
  • Die Shear Test
Request proposal
INCOMING
250
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
Request proposal
RELIFING
60
50
35
400
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
250
4
 
Mechanical Test Method Standard for Microcircuits, Particle impact noise detection test:
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-55365
J
-
24/03/2017 0:00:00
Download
Detailed spec.
MIL-PRF-55365/11
D
Det.Spec.&Am.1
24/03/2017 0:00:00
Download
QPL/QML
QPDSIS-55365
19-Oct-17
-
19/10/2017 0:00:00
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
N
N
N
N
Mechanical Data
Surface-Mount Device
Chip
Case A
Generic Functional & Electrical
Specific Functional & Electrical
6V
4,7uF
5%
Surge Option B
Qualification Status
Y

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