96003-01HXA FMSA-461/883 - Interpoint

Active
ESCC Family 40 - 99

General data

Filter, EMI, Hybrid
96003-01HXA
FMSA-461/883
Interpoint
QML H
Qualified
QPDSIS-38534 30-May-2019
CAN-8

Component popularity vs family & manufacturer

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
7500
7500
10
 
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DPA
 
Alter standard dpa activities (please ask for any customized request):
  • Please ask for a proposal
Request proposal
INCOMING
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
 
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Component dashboard

Additional information
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-38534
K
-
15/11/2017 0:00:00
Download
Detailed spec.
96003
G
-
04/02/2019 0:00:00
Download
QPL/QML
QPDSIS-38534
22-May-19
-
22/05/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Additional info

Alerts
Reference
Summary
Description
ITP-182018
Crane Electronics, Inc. Redmond, Washington Facility Relocation
Crane Electronics, Inc. has previously notified you either officially or unofficially in early 2018 of our plan to relocate the Redmond, Washington facility to an existing Crane Aerospace &amp;amp; Electronics facility in Lynnwood, Washington 15 miles north of the current Redmond facility.

Parameters

Radiation: Potential Sensitivity
Y
Y
Y
Y
CMOS & BICMOS: SEL (except SOI), SEDR, SET; BIPOLAR: SEU, SET
Only bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
HYBRID
Radiation Features: SEE
Mechanical Data
Metal
Hot Solder Dip
CAN-8
Through Hole Mount
8
Radiation Features: TID & TNID
Active add-on parts may exhibit low dose rate sensitivity.
Generic Functional & Electrical
125ºC
-65ºC to +150ºC
1,37W
Class 1
-55ºC to +125ºC
300ºC (10 seco
Specific Functional & Electrical
100MOhm
45nF
50dB @f=0,5kHz ; f=1MHz
50V
12V
1500mOhm
0,8A
Qualification Status
Y

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