5962-8767902XA HCPL-5531#300 - Avago Technologies

Active
ESCC Family 40 - 99

General data

Microcircuit, Hybrid, Linear, Dual and Quad Channel, Optically Coupled Isolator
5962-8767902XA
HCPL-5531#300
Avago Technologies
QML H
Qualified
QPDSIS-38534 30-May-2019
DIL-8

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
7500
7500
10
 
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DPA
 
Alter standard dpa activities (please ask for any customized request):
  • Please ask for a proposal
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INCOMING
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
 
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Additional information
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Top specific parameters
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-38534
K
-
15/11/2017 0:00:00
Download
Detailed spec.
5962-87679
M
-
16/01/2019 0:00:00
Download
QPL/QML
QPDSIS-38534
22-May-19
-
22/05/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Additional info

Alerts
Reference
Summary
Description
A05-001-SPG-0A
Change from Agilent Technologies to Avago Technologies branding and/or logo.
Change from Agilent Technologies branding and logo to Avago Technologies branding and/or logo.
V19-237-475316-0A
Change notification to announce a change in the IC used in the part numbers listed from 5” to 6” technology.
Change notification to announce a change in the IC used in the part numbers listed from 5” to 6” technology. This change affects MIL-PRF-38534 Class H and Commercial grade products. Class K products are not affected at this time.
Heritage
Name
Class
Application
Lifetime
Orbit
Confidential
High Reliability Projects
Confidential
Confidential
Confidential
Confidential
Confidential
High Reliability
Confidential
Confidential
Confidential
Confidential
High Reliability
Confidential
Confidential
Previous test
Type
Total
Accepted
INCOMING & RELIFING INSPECTIONS
4
4

Parameters

Radiation: Potential Sensitivity
Y
Y
Y
Y
SET
Only bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
HYBRID
Radiation Features: SEE
Mechanical Data
Ceramic
Hot Solder Dip
DIL-8
Through Hole Mount
8
Radiation Features: TID & TNID
Active add-on parts may exhibit low dose rate sensitivity.
Generic Functional & Electrical
150ºC
-65ºC to +150ºC
Class 3
-55ºC to +125ºC
2V
260ºC (10 s)
18V
Specific Functional & Electrical
2
9%
4us
2us
8mA
20mA
1,9V
6us
20V
DC
1500VDC
Transistor with Base
Qualification Status
Y

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