5962-9461205HAA AS8F512K32Q1-60/883C - Micross Components formerly Austin

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ESCC Family 40 - 99

General data

Microcircuit, Hybrid, Memory, Flash Erasable/Programmable Read Only Memory, 512K x 32-Bit
5962-9461205HAA
AS8F512K32Q1-60/883C
Micross Components formerly Austin
QML H
Qualified
QPDSIS-38534 30-May-2019
QFP-68 (Gull Wing)

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
7500
7500
10
 
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DPA
 
Alter standard dpa activities (please ask for any customized request):
  • Please ask for a proposal
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INCOMING
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
 
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Component dashboard

Additional information
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Parameter categories overview
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-38534
K
-
11/07/2019 0:00:00
Download
Detailed spec.
5962-94612
J
-
17/10/2017 0:00:00
Download
QPL/QML
QPDSIS-38534
24-Jul-19
-
24/07/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
N
N
Y
Y
CMOS & BICMOS: SEL (except SOI), SEDR, SEFI, SED; BIPOLAR: SEU, SET
CMOS TECHNOLOGY. Effect only exhibited by bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
HYBRID
Radiation Features: SEE
Mechanical Data
Ceramic
Hot Solder Dip
QFP-68 (Gull Wing)
Surface Mount
68
Radiation Features: TID & TNID
CMOS TECHNOLOGY. Just devices using bipolar technology are sensistive to low dose rate effect.
Generic Functional & Electrical
125ºC
10,2ºC/W
-65ºC to +150ºC
1,32W
Class 1
-55ºC to +125ºC
5,5V
4,5V
300ºC (10 s)
Specific Functional & Electrical
16M (512K x 32)
16M
512K x 32
60 ns
Qualification Status
Y

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