M38510/34105B2A 54F374FK - Texas Instruments
Active
ESCC Family 08 - 80
General data
Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Flip-Flops, Cascadable, Monolithic Silicon
M38510/34105B2A
54F374FK
Texas Instruments
JAN B
Qualified
QPDSIS-38535 30-May-2019
QCC-20
Component popularity vs family & manufacturer
Line Chart Js Estimated prices and leadtimes
ATN Activities estimated price and leadtime:
RVT
DPA
600
8
Alter standard dpa activities (please ask for any customized request):
- External Visual Inspection
- CSAM (Only for plastic and with added costing)
- Hermeticity (If applicable)
- PIND Test (If cavity)
- Solderability
- Marking Permanence
- Terminal Strength (Not for chip or leadless)
- Internal Visual Inspection
- SEM Inspection
- Bond Pull Test
- Die Shear Test
INCOMING
250
4
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
- Open of primary package
- Manual count of pieces (for high quantities indirect methods are considered)
- Homogenity lot verification (same marking, serialization, homogenous look)
- SLDC verification
- System update with component marking, date code and serial number
- Documentation review (CoC, Datapack)
- Weight and dimensions
- External Visual Inspection (AQL 0,65 level II)
RELIFING
60
50
35
400
4
Alter standard relifing activities (please ask for any customized request):
- Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
- NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
PIND
250
4
Mechanical Test Method Standard for Microcircuits, Particle impact noise detection test:
XRF
4
XRF Comments:
- X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
- Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
- Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Related content
December 03, 2019
EEE parts validation according to quality project requirements
Parameters
Radiation: Potential Sensitivity
N
N
Y
Y
CMOS & BICMOS: SEE (depending on device); BIPOLAR: SEU, SET
CMOS TECHNOLOGY. Effect only exhibited by bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
Bipolar
F
D-Type
With
Radiation Features: SEE
Mechanical Data
Cofired Ceramic, Metal-Seal
Hot Solder Dip
QCC-20
Surface Mount
20
Radiation Features: TID & TNID
CMOS TECHNOLOGY. Just devices using bipolar technology are sensistive to low dose rate effect.
Generic Functional & Electrical
175ºC
-65ºC to +150ºC
473mW
Class 2
-55ºC to +125ºC
4,5V
300ºC (10 s)
5,5V
Specific Functional & Electrical
TTL
TTL
8-Bits
Non-Inverting
10,5ns
Positive Edge
60MHz
Qualification Status
Y