5962-9207501MXA AS10H1042Q28/883C - Micross Components formerly Austin

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General data

Microcircuit, Digital, ECL, 68030/40 ECL/TTL Clock Driver, Monolithic Silicon
5962-9207501MXA
AS10H1042Q28/883C
Micross Components formerly Austin
QML M
Not qualified
Not Applicable
QFP-28

Component popularity vs family & manufacturer

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
4000
3000
10
 
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DPA
600
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • CSAM (Only for plastic and with added costing)
  • Hermeticity (If applicable)
  • PIND Test (If cavity)
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection
  • SEM Inspection
  • Bond Pull Test
  • Die Shear Test
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INCOMING
250
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
60
50
35
400
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
250
4
 
Mechanical Test Method Standard for Microcircuits, Particle impact noise detection test:
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Additional information
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Top specific parameters
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Parameter categories overview
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-38535
L
-
06/12/2018 0:00:00
Download
Detailed spec.
5962-92075
C
-
07/02/2018 0:00:00
Download
QPL/QML
QPDSIS-38535
15-Jan-19
-
15/01/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
Y
Y
Y
Y
CMOS & BICMOS: SEE (depending on device); BIPOLAR: SEU, SET
Only bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
Bipolar
Fanout Buffer with Divider
Radiation Features: SEE
Mechanical Data
Ceramic
Hot Solder Dip
QFP-28
Surface Mount
28
Radiation Features: TID & TNID
Bipolar technology devices are sensistive to low dose rate
Generic Functional & Electrical
150ºC
1,23ºC/W
-65ºC to +150ºC
460mW
-55ºC to +125ºC
Specific Functional & Electrical
2:8
Qualification Status
N

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