5962H09B0104QXC HX514 - Honeywell Aerospace

Obsolete
ESCC Family 08 - 42

General data

GATE ARRAY
5962H09B0104QXC
HX514
Honeywell Aerospace
QML Q
Qualified
QPDSIS-38535 30-May-2019
LGA-468

Component popularity vs family & manufacturer

Line Chart Js Line Chart Js

Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
 
Request proposal
DPA
600
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • CSAM (Only for plastic and with added costing)
  • Hermeticity (If applicable)
  • PIND Test (If cavity)
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection
  • SEM Inspection
  • Bond Pull Test
  • Die Shear Test
Request proposal
INCOMING
250
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
Request proposal
RELIFING
60
50
35
400
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
Request proposal
PIND
250
4
 
Mechanical Test Method Standard for Microcircuits, Particle impact noise detection test:
Request proposal
XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
Request proposal

Component dashboard

Additional information
No data found
Top specific parameters
No data found
Parameter categories overview
No data found
Manufacturers for similar type
No data found
Packages available for similar type
No data found

Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-38535
L
-
06/12/2018 0:00:00
Download
Detailed spec.
5962-09B01
-
-
14/03/2011 0:00:00
Download
QPL/QML
QPDSIS-38535
15-Jan-19
-
15/01/2019 0:00:00
Download

EEE parts validation according to quality project requirements

Additional info

Obsolescence & Product change
Type
Reference
Summary
Description
Risk
Risk_Components_HON
Last time buy of all SOI-IV, SOI-V, and S150 based foundry technologies
Honeywell has decided to issue a LTB of all SOI-IV, SOI-V, and S150 based foundry technologies. This LTB includes all HX2000, HX3000 and HX5000 ASICs, RH Standard Products, and foundry services products fabricated at our Plymouth, Minnesota foundry.

Parameters

Radiation: Potential Sensitivity
N
N
Y
Y
CMOS & BICMOS: SEE (depending on device); BIPOLAR: SEU, SET
CMOS TECHNOLOGY. Effect only exhibited by bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Subclassification
Radiation Features: SEE
Mechanical Data
Ceramic
Gold Plate
LGA-468
Surface Mount
468
Radiation Features: TID & TNID
CMOS TECHNOLOGY. Just devices using bipolar technology are sensistive to low dose rate effect.
dose rate = 50 – 300 rads(Si)/s
1000krad(Si)
Generic Functional & Electrical
not available
Class 2
not available
Qualification Status
Y

Alternative fine tuning

Components also viewed by other users

Print