SPB002 SPB002 BDA - Solid State Devices Inc

Obsolete
ESCC Family 04 - 01

General data

BYPASS DIODE ASSEMBLY
SPB002
SPB002 BDA
Solid State Devices Inc
HIGH RELIABILITY
Not qualified
Not Applicable
BDA

Component popularity vs family & manufacturer

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
3000
1500
10
 
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DPA
450
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • Radiographic Inspection (Only package DO-13)
  • Hermeticity (If applicable (Not for Glass Sealed))
  • PIND Test (Only for cavity packages (Not for Glass Sealed))
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection (Not for DO-13)
  • Bond Pull Test (Only if bonded (Not for Glass Sealed))
  • Die Shear Test (Only for stud mounted (Not for Glass Sealed))
  • Micro Sectioning (Only Glass Sealed and package DO-13)
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INCOMING
150
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
30
25
18
250
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
2
250
4
 
Mechanical Test Methods for Semiconductor Devices Part 2: Test Method Particle impact noise detection (PIND) test:
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Additional information
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-19500
P
Gen.Spec.&Am.4
18/05/2018 0:00:00
Download
Detailed spec.
RC0062
B
-
07/04/2003 0:00:00
Download
QPL/QML
Not Applicable
-
-
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
Mechanical Data
2
Not Available
Not Available
Surface Mount
BDA
Radiation Features: TID & TNID
Generic Functional & Electrical
Specific Functional & Electrical
5us
Qualification Status
N

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