1N6642UD1 1N6642UD1 LCC-2D - STMicroelectronics

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ESCC Family 04 - 01

General data

Aerospace 0.3 A - 100 V switching diode
1N6642UD1
1N6642UD1 LCC-2D
STMicroelectronics
EM
Not qualified
Not Applicable
LCC-2D

Component popularity vs family & manufacturer

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
3000
1500
10
 
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DPA
450
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • Radiographic Inspection (Only package DO-13)
  • Hermeticity (If applicable (Not for Glass Sealed))
  • PIND Test (Only for cavity packages (Not for Glass Sealed))
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Internal Visual Inspection (Not for DO-13)
  • Bond Pull Test (Only if bonded (Not for Glass Sealed))
  • Die Shear Test (Only for stud mounted (Not for Glass Sealed))
  • Micro Sectioning (Only Glass Sealed and package DO-13)
Request proposal
INCOMING
150
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
30
25
18
250
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
2
250
4
 
Mechanical Test Methods for Semiconductor Devices Part 2: Test Method Particle impact noise detection (PIND) test:
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Component dashboard

Additional information
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Top specific parameters
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Parameter categories overview
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Manufacturers for similar type
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Documentation

Type
Name
Issue
Rev
Date
Detailed spec.
1N6642U_STM_DS
4
-
04/12/2015 0:00:00
Download
QPL/QML
Not Applicable
-
-
Download

EEE parts validation according to quality project requirements

Additional info

Alerts
Reference
Summary
Description
CRP/19/11361
Relocation of Americas Distribution Center
STMicroelectronics Americas Distribution Center (LAX HUB), currently located in Torrance, CA operated by Ceva Logistics, will be moving to Carson, CA operated by our new service provider, Geodis.
Heritage
Name
Class
Application
Lifetime
Orbit
Confidential
High Reliability Projects
Confidential
Confidential
Confidential
Solar Orbiter
Class 1
Scientific
7 years
Heliocentric
JUICE
Class 1
Scientific
11 years
Jupiter Orbit
Confidential
Confidential
High Reliability
Confidential
Confidential
Confidential
Confidential
High Reliability
Confidential
Confidential
Confidential
Confidential
High Reliability
Confidential
Confidential
Confidential
Confidential
High Reliability
Confidential
Confidential
Previous test
Type
Total
Accepted
INCOMING & RELIFING INSPECTIONS
13
13

Parameters

Radiation: Potential Sensitivity
Mechanical Data
2
Gold plating, electro-deposited
Ceramic
Surface Mount
LCC-2D
Radiation Features: TID & TNID
Generic Functional & Electrical
-65ºC to +175ºC
-65ºC to +175ºC
60ºC/W
280ºC/W
175ºC
Specific Functional & Electrical
2A
20ns
75V
5pF
100V
300mA
20ns
Qualification Status
N

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