CWR09MB474KCA CWR09 470nF 10% 35V Case B - AVX Corp.

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ESCC Family 01 -

General data

Capacitors, Chip, Fixed, Tantalum, Established Reliability, Styles CWR06 and CWR09
CWR09MB474KCA
CWR09 470nF 10% 35V Case B
AVX Corp.
WEIBULL C
Qualified
QPDSIS-55365 01-Jun-2016
Chip

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Estimated prices and leadtimes

ATN Activities estimated price and leadtime:
 
RVT
 
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DPA
275
8
 
Alter standard dpa activities (please ask for any customized request):
  • External Visual Inspection
  • Radiographic Inspection (Only for Tantalum non solid)
  • Hermeticity (Only for Tantalum)
  • Solderability
  • Marking Permanence
  • Terminal Strength (Not for chip or leadless)
  • Micro Sectioning (Not for Tantalum non solid)
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INCOMING
150
4
 
Alter standard incoming inspection activities (lot size < 280 pcs, please ask for any customized request):
  • Open of primary package
  • Manual count of pieces (for high quantities indirect methods are considered)
  • Homogenity lot verification (same marking, serialization, homogenous look)
  • SLDC verification
  • System update with component marking, date code and serial number
  • Documentation review (CoC, Datapack)
  • Weight and dimensions
  • External Visual Inspection (AQL 0,65 level II)
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RELIFING
30
25
18
250
4
 
Alter standard relifing activities (please ask for any customized request):
  • Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Hermeticity , Solderability in 1 PIECE (if applicable)
  • NO Cavity devices: External Visual Inspection, Electrical Measurements (price valid for existing developments), Solderability in 1 PIECE (if applicable)
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PIND
 
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XRF
100
4
 
XRF Comments:
  • X-ray fluorescence equipment (XRF) is used to perform the material analysis. XRF allows to identify the metals present in complex samples while providing quantitative accuracy sufficient to preclude prohibited material or its inadequate proportions.
  • Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
  • Material analysis is typically performed during the incoming inspection when scan locations for the analysis are selected depending on the specific requirements and the detailed specification of each part. It also may be implemented as a go/no-go test when specific requirements need to be checked, or may include read-and-record measurements and graphical analysis of the data obtained.
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Documentation

Type
Name
Issue
Rev
Date
Generic spec.
MIL-PRF-55365
J
-
24/03/2017 0:00:00
Download
Detailed spec.
MIL-PRF-55365/4
J
-
05/09/2014 0:00:00
Download
QPL/QML
QPDSIS-55365
19-Oct-17
-
19/10/2017 0:00:00
Download

EEE parts validation according to quality project requirements

Parameters

Radiation: Potential Sensitivity
N
N
N
N
Mechanical Data
Surface-Mount Device
Chip
Case B
Generic Functional & Electrical
Specific Functional & Electrical
35V
470nF
10%
Surge Option A
Qualification Status
Y

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