- Posted by Manuel Padial Pérez
- On April 23, 2020
The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.
Mil-Std-883 Method 2003 employs the Dip and Look Method, requiring the following equipment:
- Enough size solder pot that can maintain solder at a specified temperature.
- A steam aging equipment for ‘aging’ the samples prior to testing
- A dipping mechanism capable of controlling the rates of immersion and emersion, as well as dwell time, of the terminations.
- Microscopy system that facilitates the external visual inspection at a minimum magnification of 10X.
The general solderability test procedure consists of the following steps following the Mil-Std-883 Method 2003:
- Proper preparation of the samples which must not include wiping, cleaning, scraping, or abrasive cleaning of the terminations to be tested.
- Aging of the samples in a steam ager, consisting on exposing the surfaces to be tested to water vapor for 8 hours and drying them, either by baking at 100ºC for no more than 1 hour in a dry atmosphere or air drying the mat ambient temperature for a minimum of 15 minutes.
- Proper application of flux to the terminations.
- Solder dipping by immersing the terminations in static solder at a uniform temperature of 245ºC +/- 5º C.
- Examination of the terminations at 10-15X magnification.
Latest posts by Manuel Padial Pérez (see all)
- MIL-STD-883 METHOD 2003 – Solderability Testing - April 23, 2020
- Failure Analysis in Electronic Components - April 21, 2020
- Hi-Rel Intermediate bus converter and point of load - April 11, 2020