- Posted by Manuel Padial Pérez
- On September 29, 2019
Dealing with electromagnetic and radio frequency interferences (EMI/RFI) generated by electronic devices, where a design is complete and modifications can’t be made, damping radiated emissions may be the only option to solve suppression issues. As frequencies of signals increase to the gigahertz range the need for a highly responsive material becomes even more important.
Kemet Flex Suppressor® are flexible, polymer sheets with micro-magnetic foils used to attenuate or suppress electromagnetic and radio frequency interferences (EMI/RFI) generated by electronic devices, providing better attenuation performance than ferrite-based alternatives. The sheets are composed of magnetic powder that is suspended in the flexible polymer material. This magnetic powder is a proprietary mixture made primarily of iron and silicon. The iron flakes are so thin that eddy currents are not able to form on the skin, causing the electromagnetic field to collapse. Because the metallic flakes are separated from each, the overall sheet is non-conductive. This means it can be placed directly on ICs without fear of causing shorts between pins or from nearby metal shields.
Depending on the amount of permeability needed, the material is available in several thicknesses. The thicker the material used, the higher the permeability. There is a non-linear relationship between thickness and permeability.
Flex Suppressor® sheets are thin and flexible, with sheet thickness ranging from 0.025mm to 1.0mm. usable in a wide range from MHz band to GHz band. Sheet sizes range from 80mm x 80mm to 240mm x 240mm and can be easily cut to shape for application to ICs, PCBs, enclosures, and cables and are available with an adhesive backing for fast installation to attach to an IC, circuit board or enclosure.
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