INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Working process of C-SAM in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On March 28, 2019
0

Scanning Acoustic Microscopy (C-SAM) for the non-destructive internal inspection of Microelectronic Parts: How it Works and Physics Fundamentals.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Different types of Corrosion / Contamination in Crimped Connectors

Posted by Francisco Javier Aparicio Rebollo
On March 14, 2019
0

Crimped connectors are gas-tight junctions ideally protected against environmental contaminants and corrosive agents. Nonetheless inappropriate crimping and inherent connector and wire defects reduce this protection. Thus, depending of the storage atmosphere, non-conducting corrosion products can be formed, or stress corrosion cracking can be eventually induced. The former act as insolation layer that reduces the connector conductivity and both corrosion effects are identified as critical factors involved in common fails reported for electrical connectors.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Discover a PCB Failure Analysis: the Pad Cratering

Posted by Mari Carmen López
On March 11, 2019
0

One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the figure) and leads to the complete separation of the pad from the PCB. This failure mode is especially relevant for assembled BGA, CGA and bottom termination components fabricated by lead-free and halogen-free processes and it is related to mechanical stresses experienced in PCB systems.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Test Methods in Electronic parts. The Vibration Tests

Posted by María Teresa Rodríguez
On February 13, 2019
2

The purpose of vibration tests is to evaluate the effect caused on component parts by vibration in a specified frequency range. The samples are subjected to testing under different conditions, as described below, in accordance with the respective applicable standards. The test conditions differ in terms of duration, frequency range, vibration waveform, amplitude, etc.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Internal procedure

Posted by Francisco Javier Aparicio Rebollo
On January 22, 2019
0

Some specific user requirements cannot be fulfilled by QPL parts (scientific missions). In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification. If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.

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Tag: Testing Method