Analog Devices has established three commercial space product screening and qualification flows to address New Space needs, designed to offer the best price/reliability ratio for applications targetting different requirements
the datasheet is not always under strict configuration control, and the information included can be changed without notice or even be outdated. This is, the datasheet is always under manufacturer control. This also implies that some parameter information that may be critical for a specific customer application may not be shown in the datasheet if the manufacturer does not consider it typically important. Furthermore, it may happen that this parameter has not even been measured ever.
Microchip, a global leader in the manufacture of FPGAs for Military and Space use has planned to release intermediate quality levels FPGAs for New Space projects. This will allow a reduction in cost of the component and lead time on FPGAs.
The objective of thermal cycling testing is to determine the ability of parts and solder interconnects to resist extremely high and low temperatures, as well as their ability to endure cyclical exposures to extreme temperatures.
Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.
Using stress testing, defects are weeded out in a product where the root causes cannot be eliminated. Removing all the defective parts (infant mortality) brings the lot to the constant failure rate (working life) phase.
The screening does not increase the reliability of the components but removes those showing weakness or defects. Tests, inspections or combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.
PPCP defines the technical provisions and all the associated procedures for EEE parts, including all the engineering and quality assurance aspects. This allows to establish an homogeneity regarding parts quality and dependability during all project procurement phase.
Product Assurance (PA) stands as a fundamental pillar. Product Assurance can be defined as the set of requirements that materials, processes and parts must comply to assure proper performance of the equipment during the mission lifetime. These rules are gathered in a PA Plan.
Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension.
Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early failure, thorough diagnosis and deep understanding of the main failure causes are the starting point to preclude future occurrence and improve the system reliability.