- Posted by doEEEt Media Group
- On April 13, 2021
MT components used in conductive epoxy processes must be compatible with the hydroscopic nature of electrically conductive epoxies. Conductive epoxy attachment offers a very low stress, low-temperature attachment method of creating end circuitry. Several important trends in SMT component technology are emerging, possibly limiting (small case size, FlexiTerm termination) – or expand (MLO technology) using conductive epoxy as an attachment method.