- Posted by José Francisco Largaespada
- On October 7, 2019
What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?
- Posted by doEEEt Media Group
- On June 17, 2019
For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.
- Posted by Tomáš Zedníček
- On April 30, 2019
IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods – radiation, conduction, convection, and condensation. In fact, all heat transfers are used in modern reflow ovens. The heat is applied from above, below, or all directions dependent on the equipment being used. In classical infrared “radiation” reflow ovens, several ceramic heaters are transferring the heat to the assemblies, moving through the oven on a conveyor belt, by radiation.
- Posted by Jesús Enrique Barbero Muñoz
- On February 14, 2019
The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.