EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2019
0

Guidelines for Selection of Ceramic Capacitors for Space Applications: Cracking Problems in Low-Voltage Chip Ceramic Capacitors

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

Posted by José Francisco Largaespada
On October 7, 2019
0

What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MacroVoids in assembled BGA packages

Posted by Mari Carmen López
On August 14, 2019
0

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

ACTIVES, EEE Components, SPECIFICATIONS / QPLs

Review of main changes in generic specification MIL-PRF-55310 REV. F

Posted by José Francisco Largaespada
On July 19, 2019
0

Space standards (such as ESCC and MIL standards) have helped throughout the years to develop the industry and to achieve de mission goals. Standards improve the competitiveness, efficiency and knowledge transfer within space business. However, standards are not frozen documents, but rather they must change and adapt to the current requirements of the industry and the new developments and knowledge gathered during all the years of space missions.

EEE Components, SPECIFICATIONS / QPLs

Issue 8 of Generic Specification ESCC 5000

Posted by Manuel Padial Pérez
On July 2, 2019
0

What have been the changes in the New Issue 8 of GENERIC SPECIFICATION ESCC 5000, check the comparatives with the Issue 7

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XPS, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 30, 2019
0

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Flow Stages in Vibration Testing on Hi-Rel EEE Parts

Posted by María Teresa Rodríguez
On May 25, 2019
0

Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XRF tool, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 16, 2019
0

XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

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Tag: DPA