- Posted by doEEEt Media Group
- On April 27, 2020
Vishay ThermaWickTM SMD Thermal Jumper Chip Removes Heat From Electrically Isolated Components
Vishay Intertechnology, Inc. introduced the ThermaWickTM THJP series surface-mount thermal jumper chip. The Vishay Dale Thin Film device allows designers to transfer heat from electrically isolated components by providing a thermally conductive pathway to a ground plane or common heatsink.
Featuring an aluminium nitride substrate with a high 170 W/m°K thermal conductivity, the chip released today is capable of reducing the temperature of connected components by over 25%. This reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved.
The THJP’s low capacitance down to 0.07 pF makes it an excellent choice for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters; RF amplifiers; synthesizers; pin and laser diodes; and filters for AMS, industrial, and telecommunications applications.
The device is available in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead (Pb)-bearing and leads (Pb)-free wraparound terminations.
Device Specification Table:
|wdt_ID||Case size||Thermal resistance (°C/W)||Thermal conductance (mW/°C)||Capacitance (pF)|
- Pyrotechnic Cable Cutter at Cryogenic Temperature - January 18, 2023
- High Current, High Temperature Edge-Wound Inductors - January 13, 2023
- Snap-In Supercapacitors - January 13, 2023