INSPECTION, ELECTRICAL & VERIFICATION

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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Rosetta

  • Posted by doEEEt Media Group
  • On January 13, 2020
  • 0
The space probe Rosetta was built by the European Space Agency (ESA ) with the objective of reach and study Comet 67P/Churyumov-Gerasimenko. Was launched on March 2004 from Kourou. To place it on the required orbit to rendezvous with Comet 67P/ Churyumov-Gerasimenko it received four gravity assist manoeuvres: 3 from Earth (4 March 2005, 13 November 2007 and 13 November 2009) and 1 from Mars (25 February 2007).
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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Slogan GaN based technologies

  • Posted by doEEEt Media Group
  • On January 13, 2020
  • 0
SLOGAN is an international research project co-funded from EU 7th Framework Programme. The project Space Qualification of High-Power SSPA based on GaN technology (SLOGAN) aims at designing, developing, implementing a GaN SSPA Engineering Qualification Model (EQM) for the next generation of Galileo satellites.
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ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

HTV Spacecraft

  • Posted by doEEEt Media Group
  • On January 13, 2020
  • 0
The HTV vehicle is an unmanned spacecraft that in an autonomous way is able to supply food, replacement parts, test equipment and other items to the crew of the ISS. The “brain” of this vehicle – it is Avionic Module – was developed by Mitsubishi Electric. Currently, several launches of this ship are planned in addition to the 6 (HTV-1, HTV-2, HTV-3, HTV-4, HTV-5 and HTV-6) made to date.
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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Crimped Connectors, What about Reliability and Testing?

  • Posted by Mari Carmen López
  • On January 13, 2020
  • 1
Crimping together with wire wrapping and spring clip systems are the preferred alternatives for the solderless connection of electrical conductors. In particular, crimped connectors offer several advantages such as: Gas-tightness and protection against oxidation and corrosive environments, High mechanical strength is inherent to the lack of alloys in the mechanical joint, Large versatility in terms of the wire diameters.
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