Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies.  For applications that require very high thermal and electrical conductivity, we have many semi-sintering epoxies which lend themselves to chip-on-board assembly.  Die are typically electrically connected using Au ball bonding or Al Wedge Bonding.

Alter Technology UK can also attach a die face-down onto a PCB using flip-chip technology, either using solder balls pre-applied at a wafer level or our in-house stud bumping process.  The die is then protected using a glob top or Dam/Fill encapsulation process.  Most chip-on-board assembly can also be combined with our fast-turnaround service.

For more specialist requirements, please contact Alter Technology UK for a detailed technical review.