- Posted by doEEEt Media Group
- On March 12, 2020
Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies. For applications that require very high thermal and electrical conductivity, we have many semi-sintering epoxies which lend themselves to chip-on-board assembly. Die are typically electrically connected using Au ball bonding or Al Wedge Bonding.
Alter Technology UK can also attach a die face-down onto a PCB using flip-chip technology, either using solder balls pre-applied at a wafer level or our in-house stud bumping process. The die is then protected using a glob top or Dam/Fill encapsulation process. Most chip-on-board assembly can also be combined with our fast-turnaround service.
For more specialist requirements, please contact Alter Technology UK for a detailed technical review.
Contact us for more information
- Stability of Optoelectronic parameters for space applications - November 16, 2023
- C-SAM Ultrasonic Analysis to Identify High Voltage MLCC Defects - October 19, 2023
- SMD Inductors - October 19, 2023