Die Bonding Services
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attaches material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability.
Solder Die Attach
Alter Technology (formerly Optocap), has experience with a wide range of solder materials including soft and hard solders, Pb-free solders, Eutectic solders and solders for operation over a wide temperature range.
This knowledge is critical in supporting our customers in making the correct decisions on solder material selection for their product.
For many Opto, MEMS or Sensor devices fluxes can pose reliability concerns with contamination of the sensitive active regions of these devices. As a result, many of the solders attach processes at Alter Technology UK  are based on a flux free solder process utilizing solder preforms or pre-tinned substrates with a subsequent Vacuum Reflow process, or reflow using Pulsed Heat-Stages with reducing or cover gas to prevent oxidation.
This knowledge is critical in supporting our customers in making the correct decisions on solder material selection for their product.
For many Opto, MEMS or Sensor devices fluxes can pose reliability concerns with contamination of the sensitive active regions of these devices. As a result, many of the solders attach processes at Alter Technology UK  are based on a flux free solder process utilizing solder preforms or pre-tinned substrates with a subsequent Vacuum Reflow process, or reflow using Pulsed Heat-Stages with reducing or cover gas to prevent oxidation.
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