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LIDAR echo emulator

LIDAR echo emulator

Pawel Adamiec
October 7, 2021
0
The LIDAR Echo Emulator (LEE) emulates the returned signals from a Lidar system. As the return signal of a Lidar system depends on the target, this implies the capability of shaping the laser’s return...
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Testing Methods EEE Parts

residual-gas-analysisATN

Why do a Residual Gas Analysis?

Dimas Morilla
August 28, 2020
0
Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the componen...
HAST test

Know all the characteristics of a HAST test?

Álvaro Ricca Soaje
February 21, 2019
1
HAST test reduces the time it takes to complete the typical humidity 85 ºC / 85% RH testing for semiconductors (96 HAST hours are equivalent to 1000 THB hours). By elevating temperatures above 100°C (usually up to 130°C)...
SAM inspection ATN

OpAmps in Plastic Packages

Francisco Javier Aparicio Rebollo
December 17, 2020
0
Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die...
SAM Webinar AVAILABLE

Scanning Acoustic Microscopy – Webinar

doEEEt Media Group
June 17, 2020
2
This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspectio...
Internal visual inspect

Internal Visual Inspection of Hi-Rel EEE Parts

David Ramirez - Cruzado
November 6, 2020
0
The aim of this destructive test is to demonstrate that the internal materials, design, construction, and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed...
MacroVoids in assembled BGA packages

MacroVoids in assembled BGA packages

Mari Carmen López
August 14, 2019
0
BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such dev...

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