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doEEEt Media Group

Buck/Boost topologies and EMI filtering

doEEEt Media Group
November 23, 2020
EMI filtering is a phenome that is known but always hard to understand and to take care of it. In this webinar, we will discuss the typical flow of the noise. Oscillation at the input of the converter...
Space talks 5
doEEEt Media Group


doEEEt Media Group
November 17, 2020
In this podcast, Sebastien Moranta Coordinator of Studies, European Space Policy Institute, Vienna, Planning and supervision of ESPI work plan, Project management and quality assurance and ESPI databa...
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Testing Methods EEE Parts

Growth Theory in Tin Whiskers on EEE Parts

How and Why Tin Whisker Grow in Electronic components

Dimas Morilla
April 4, 2019
The Tin Whisker is a conductive hairy-like crystalline structure of tin that grow spontaneously from a tinned surface, usually as a result of the stress of some sort, and maybe long enough to cause a big problem for those applications demanding a high level of reliability.

Microwave Solderless Measurements why the use?

Aintzane Lujambio Genua
April 24, 2019
Screening activities for space applications require extreme care during the manipulation of the EEE parts to be assembled on a spacecraft. This means that special attention must be paid to avoid damage to the parts, as well as any contamination by foreign materials.
Soldering, PCB Handling and Rework

Mounting Guidelines: Soldering, PCB Handling & Rework

Tomáš Zedníček
March 18, 2019
What are the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height. This does not mean that all solder joints outside of this range should be repaired. It does mean that this is the target for the process engineer to reach for in his process. As many as possible of the solder fillets on the board should be in this range.
Resistance To Solvent

Resistance To Solvent the Importance marking testing on EEE Parts

Jesús Enrique Barbero Muñoz
March 28, 2019
The purpose of this test is to verify that the markings on component parts will not become illegible when subjected to solvents (e.g. during the board cleaning process after parts assembly) or during normal handling, and that the solvents employed for the test will not cause deleterious, mechanical or electrical damage or deterioration of the materials or finishes. The applicable test standards are MIL-STD-750 method 1022, MIL-STD-883 method 2015, or ESCC 24800, among others, depending on the part type.
XPS Working principle

XPS, how it works and its applications in EEE parts

Francisco Javier Aparicio Rebollo
May 30, 2019
X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research
Wet chemical jet

What is Decapsulation of packaged devices?

Francisco Javier Aparicio Rebollo
February 20, 2019
Decapsulation of packaged devices exposes the internal elements of the device under test. Opening devices by this method allows the inspection of the die, interconnects and other features typically examined during failure analysis (FA), constructional analysis (CA) and destructive physical analysis (DPA).
LEO and Lower Cost Space Missions Past Webinar

Webinar – Managing EEE Components for LEO and Lower Cost Space Missions

doEEEt Media Group
September 10, 2020
This webinar will go over some of the challenges of selecting EEE components for lower-cost space missions. It will present the continuing need for radiation tolerance in the components, as well as quality needs. The Renesas line of Radiation-Tolerant and Radiation-Hardened Plastic products will also be discussed, including qualification, screening and assurance testing flows.
Evaluation of Electronic Assemblies aTN

Evaluation of Electronic Assemblies

Mari Carmen López
July 18, 2020
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).


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