Constructional Analysis in Microsection Inspection
- Posted by Mari Carmen López
- On July 23, 2019
- 0
Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices.
The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected to several polishing steps to achieve a high-quality surface to be analyzed by metallographic microscopy.