IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods – radiation, conduction, convection, and condensation. In fact, all heat transfers are used in modern reflow ovens. The heat is applied from above, below, or all directions dependent on the equipment being used. In classical infrared “radiation” reflow ovens, several ceramic heaters are transferring the heat to the assemblies, moving through the oven on a conveyor belt, by radiation.
Microchip’s AVR8 ATmegaS64M1/ATmegaS128 and ARM32 M7 SAMV71Q21 Flight Models (FM) are available in ceramic package with screening equivalent to QML class Q and QML class V quality levels. Engineering samples are available as well. Developing radiation-hardened systems for space applications means long lead times and high cost toward achieving the necessary levels of reliability for multi-year missions in harsh environments.
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (IDT), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
Semicoa has implemented a new ceramic surface mount package for their qualified rectifier diodes from MIL-PRF-19500/477 Semicoa is a supplier that design and development of bipolar power devices for high-reliability military, defense, aerospace, and space applications for 50 years.
Screening activities for space applications require extreme care during the manipulation of the EEE parts to be assembled on a spacecraft. This means that special attention must be paid to avoid damage to the parts, as well as any contamination by foreign materials.
Humidity may affect the life expectancy of a component by creating stresses on the part materials and altering its electrical properties in a way that the component reliability is significantly diminished. Temperature Humidity Test is those performed with the aim of evaluating the properties of materials used in components and the reliability of non-hermetic packaged devices in humid environments.
The U.S. Defense Logistics Agency has approved Solid State Devices, Inc.’s 1N5807, 1N5809, and 1N5811, with axial solid silver leaded hermetic packaging, for inclusion on its Qualified Product List (QPL). JAN, JANTX, JANTXV, and JANS screening levels per MIL-PRF-19500/477 are available for these 6 Amps, 50 – 150 Volts power rectifiers.
The evolution of power distribution in the spacecraft goes into a modular architecture direction. Especially the secondary power distribution from the satellite bus to the modules can be made more efficient by applying modular design and standard power interfaces.
Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific focal points, which compromises the suitable operation and reliability of microelectronic systems and can potentially decrease the lifetime.